Veröffentlichungen
Labor für Elektronikintegration

  1. Hochschule Kempten
  2. Fakultät Elektrotechnik
  3. Labore
  4. Elektronikintegration
  5. Veröffentlichungen

Veröffentlichungen

(1)A. Schiffmacher, L. Litzenberger, J. Wilde, V. Polezhaev, T. Huesgen, Silver Sintering on Organic Substrates for the embedding of power semiconductor devices, Electronics Components and Technology Conference ECTC, Las Vegas, May, 2019
(2)V. Polezhaev, A.B. Sharma, L. Litzenberger, A. Schiffmacher, J. Wilde, T. Huesgen, Development of a novel 600V/50A power package with semiconductor chips sandwiched between PCB substrates using double-side Ag-sintering, submitted for presentation at PCIM 2019
(3)J. Schnur, A.B.Sharma, N. Haag, T. Kuwan, T. Huesgen, Performance Evaluation of Integrated Jet Impingement Heat Exchanger for PCBEmbedded Power Modules using Dielectric Coolant, submitted for presentation at IMAPS Thermal, La Rochelle, 2019
(4)A.B. Sharma, J. Schnur, N. Haag, T. Huesgen, Single-Switch Prepackages - A Modular approach to PCB embedding, IMAPS Herbsttagung, 18./19. Oktober 2018
 
(5)A. Schiffmacher, L. Litzenberger, J. Wilde, V. Polezhaev, T. Huesgen, Power Electronic Assemblies on Printed Wiring Boards Mounted by Silver Sintering, Electronic System-Integration Technology Conference ESTC, Dresden, September 2018
 
(6)T. Huesgen, A.B. Sharma, J. Schnur, T. Kuwan, N. Haag, F. Hadersbeck, M. Hohmann, Leiterplattenembedding von Halbleiterbauelementen für die Leistungselektronik – vom Modul zum System, Symposium Elektronik und Systemintegration, Landshut, 11st April, 2018
 
(7)A.B. Sharma, J. Schnur, N. Haag, T. Kuwan, A. Stogel, T. Huesgen, Fabrication of PCB Embedded 1200V/50A Power Module and Benchmarking with Commercial DBC-based Package. In CIPS 2018; 10th International Conference on Integrated Power Electronics Systems, Stuttgart, March, 2018
 
(8)J. Schnur, A.B. Sharma, N. Haag, T. Kuwan, A. Stogel, T. Huesgen, Design and Fabrication of PCB Embedded Power Module with Integrated Heat Exchanger for Dielectric Coolant. In CIPS 2018; 10th International Conference on Integrated Power Electronics Systems, Stuttgart, March, 2018
 
(9)T. Huesgen, A.B. Sharma, J. Schnur, T. Kuwan, N. Haag, F. Hadersbeck, M. Hohmann, Leiterplattenembedding von Halbleiterbauelementen für die Leistungselektronik – vom Modul zum System, EBL 2018, Elektronische Baugruppen und Leiterplatten, Fellbach, 21st/22nd Febuary, 2018
 
(10)A. Stogel, T. Zeh, F. Goldschmidtböing, P. Woias, T. Huesgen, A., Integration von Piezoelektrika in Multilayer-Leiterplatten –eine Machbarkeitsstudie, Mikrosystemtechnik Kongress, München Oktober, 2017
 
(11)A.B. Sharma, D. Paul, M. Kreck, Y. Rahmoun, P. Anders, M. Gruber, T. Huesgen, PCB Embedded Power Package with Reinforced Top-Side Chip Contacts, Electronic System-Integration Technology Conference ESTC, Grenoble, September 2016

Kontakt

Prof. Dr.-Ing. Till Huesgen

Tel. +49 (0) 831 2523- 9247
Fax +49 (0) 831-25-23-554

till.huesgen(at)hs-kempten.de

Standort

Leonhardstraße 19
87437 Kempten

Raum:
E1, E3, E3

 Anfahrt und Lageplan