| (1) | A. Schiffmacher, L. Litzenberger, J. Wilde, V. Polezhaev, T. Huesgen, Silver Sintering on Organic Substrates for the embedding of power semiconductor devices, Electronics Components and Technology Conference ECTC, Las Vegas, May, 2019 |
| (2) | V. Polezhaev, A.B. Sharma, L. Litzenberger, A. Schiffmacher, J. Wilde, T. Huesgen, Development of a novel 600V/50A power package with semiconductor chips sandwiched between PCB substrates using double-side Ag-sintering, submitted for presentation at PCIM 2019 |
| (3) | J. Schnur, A.B.Sharma, N. Haag, T. Kuwan, T. Huesgen, Performance Evaluation of Integrated Jet Impingement Heat Exchanger for PCBEmbedded Power Modules using Dielectric Coolant, submitted for presentation at IMAPS Thermal, La Rochelle, 2019 |
| (4) | A.B. Sharma, J. Schnur, N. Haag, T. Huesgen, Single-Switch Prepackages - A Modular approach to PCB embedding, IMAPS Herbsttagung, 18./19. Oktober 2018 |
| (5) | A. Schiffmacher, L. Litzenberger, J. Wilde, V. Polezhaev, T. Huesgen, Power Electronic Assemblies on Printed Wiring Boards Mounted by Silver Sintering, Electronic System-Integration Technology Conference ESTC, Dresden, September 2018 |
| (6) | T. Huesgen, A.B. Sharma, J. Schnur, T. Kuwan, N. Haag, F. Hadersbeck, M. Hohmann, Leiterplattenembedding von Halbleiterbauelementen für die Leistungselektronik – vom Modul zum System, Symposium Elektronik und Systemintegration, Landshut, 11st April, 2018 |
| (7) | A.B. Sharma, J. Schnur, N. Haag, T. Kuwan, A. Stogel, T. Huesgen, Fabrication of PCB Embedded 1200V/50A Power Module and Benchmarking with Commercial DBC-based Package. In CIPS 2018; 10th International Conference on Integrated Power Electronics Systems, Stuttgart, March, 2018 |
| (8) | J. Schnur, A.B. Sharma, N. Haag, T. Kuwan, A. Stogel, T. Huesgen, Design and Fabrication of PCB Embedded Power Module with Integrated Heat Exchanger for Dielectric Coolant. In CIPS 2018; 10th International Conference on Integrated Power Electronics Systems, Stuttgart, March, 2018 |
| (9) | T. Huesgen, A.B. Sharma, J. Schnur, T. Kuwan, N. Haag, F. Hadersbeck, M. Hohmann, Leiterplattenembedding von Halbleiterbauelementen für die Leistungselektronik – vom Modul zum System, EBL 2018, Elektronische Baugruppen und Leiterplatten, Fellbach, 21st/22nd Febuary, 2018 |
| (10) | A. Stogel, T. Zeh, F. Goldschmidtböing, P. Woias, T. Huesgen, A., Integration von Piezoelektrika in Multilayer-Leiterplatten –eine Machbarkeitsstudie, Mikrosystemtechnik Kongress, München Oktober, 2017 |
| (11) | A.B. Sharma, D. Paul, M. Kreck, Y. Rahmoun, P. Anders, M. Gruber, T. Huesgen, PCB Embedded Power Package with Reinforced Top-Side Chip Contacts, Electronic System-Integration Technology Conference ESTC, Grenoble, September 2016 |
Prof. Dr.-Ing. Till Huesgen
Tel. +49 (0) 831 2523- 9247
Fax +49 (0) 831-25-23-554
till.huesgen(at)hs-kempten.de